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![Proteus® LSG HS PP]( "Proteus® LSG HS PP")
Proteus® LSG HS PP
Proteus® LSG HS PP (heat-stabilized Polypropylene) exhibits a heat deflection temperature that allows the material to be used in repeated steam and autoclave sterilization cycles. It is highly resistant to cleaning agents, disinfectants and various solvents.
- Typical applications for Proteus® LSG HS PP include surgical trays, caddies and instrument components.
The production process includes a special heat-treatment phase that allows for the higher heat deflection temperature and, thus, improved machinability and dimensional stability. Under the label of MCAM-Quadrant's Life Science Grades (LSG), Proteus® LSG HS PP shapes are tested and certified for biocompatibility per ISO10993-5 to ensure quality throughout the entire manufacturing process. This offers the designer increased safety, approval facilitation, as well as reduced cost and time to market.
- The material is available as plates in white and black (standard colors); other colors can be produced on a make to order (MTO) basis.
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PVC Angle
PVC angle provides a reliable means for joining PVC sheets to provide corrosion resistant tanks, cabinets, and other items. Joining is accomplished by the solvent cementing process or hot air welding methods.
- PVC Angle is available in Grey, White & Clear.
- Also see CPVC Angle for higher temperature ratings.
All PVC stock machining shapes shall be manufactured from a rigid, unfilled, general-purpose-grade Polyvinyl Chloride (PVC) compound with a Cell Classification of 12454, per ASTM D1784. (Callout Designation S-PVC0111 per ASTM D6263).
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PVC Pipe - Clear
Clear PVC Pipes - Clear Rigid PVC piping provides a versatile, cost-effective alternative for many piping applications, particularly those where visual monitoring of processes is critical.
The benefits of rigid PVC piping are well recognized: exceptional corrosion resistance; smooth interior walls for unimpeded flow and reduced sediment buildup; non-contaminating for purity applications; fast, reliable solvent-welded connections; good pressure-bearing capability; and ease of handling and installation, to name a few.
All of these important benefits are now available in a unique product with optimum clarity. This clarity provides the all-round visibility that specialized applications demand — whether it be clean room applications, sight glass, dual-containment or various other processing applications where continuous monitoring is necessary.
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![PVC Shrink Tubing HS105]( "PVC Shrink Tubing HS105")
PVC Shrink Tubing HS105
PVC HEAT SHRINKABLE TUBING HS-105
- Applications requiring smooth, tight-fitting, aesthetic coverings, especially for products with irregular shapes
- Protecting products - outdoors and indoors - from UV light, fading, harsh chemicals, chlorinated cleansers, moisture, salt water, fungus, dirt, abrasion and splintering
- Providing "crystal clear" see-through protection that will not become cloudy, yellow or crack over time
- The preferred choice for use with PVC wire and cable
- Insulation and strain relief of wire harnesses, terminals and wire splices
- Applications requiring outstanding dielectric and mechanical protection without damage to enclosed or adjacent components or underlying material
- Identifying and color coding wires, cables, piping, machinery, parts, etc.
SPECIFICATIONS:
- Lead free and RoHS compliant
- UL Subject 224 VW-1
- CSA OFT rated for 600 V
- ASTM D 3150
- SAE-AMS-DTL-23053/2 Class 2
TECHNICAL DATA:
- Shrink Ratio: 2:1
- Minimum Recommended Shrink Temperature: 100°C (212°F)
- Operating Temperature Range: -20°C to 105°C
- Longitudinal Shrinkage: Approximately 15%
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![PVC-350™ ESd Sheet (Bending Grade)]( "PVC-350™ ESd Sheet (Bending Grade)")
PVC-350™ ESd Sheet (Bending Grade)
PVC-350™ (Bending Grade) - Static Dissipative Plastic Sheet
PVC-350™ is a plastic sheet product designed to control static electricity for a wide range of end uses. It is a high quality polyvinyl chloride sheet which has been surfaced with SciCron Technologies proprietary, clear, C-350™ static dissipative surfacing. This unique technology prevents charge generation on the sheet surfaces, thereby controlling particulate attraction and preventing electrostatic discharge (ESD) events. This performance is permanent and totally independent of humidity. PVC-350 offers exceptional design versatility since it fabricates simply, is light in weight and is available in large sheet sizes. It also exhibits excellent chemical resistance, plus superior flame spread and bending characteristics.
Applications
PVC-350 resists tribocharging under all circumstances and cannot generate a charge when properly grounded. This makes it ideal for use in manufacturing and assembly operations for charge sensitive electronic components where it can help prevent both immediate and latent ESD caused defects. Since it resists charge build-up it does not attract contaminants, so it can also help prevent contamination-related rejects in ultra-clean manufacturing operations. Consequently, it is suitable for use in the semi-conductor, electronic, and micro-manufacturing industries. Typical applications include contoured panels and fabri-cated items which require heat bending, such as; covers, windows, doors, and access panels for electronic equip-ment, machines and instruments; fabricated desiccators, cabinets, and boxes with heat bent parts; and formed process equipment enclosures. The product also has many general industrial uses, including protection for static charge sensitive manufacturing devices and control of spark discharge in explosive environments.
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![Regulatory Compliance Information]( "Regulatory Compliance Information")
Regulatory Compliance Information
Regulatory Compliance & Agency Approval Information for Plastic Materials
Professional Plastics & MCAM-Quadrant EPP materials are commonly used in processing equipment and products requiring various types of regulatory agency compliance. We routinely work with these agencies to assure the widest variety of our products are recognized as being compliant——giving designers the broadest selection candidate materials. A brief overview of the six most common agencies is provided below. Additionally, we have specific product listings with Underwriters Laboratories (UL), American Bureau of Shipping (ABS), ASTM and many global manufacturers such as Ford, General Electric, Boeing and McDonnell Douglas. Professional Plastics can work with customers to develop unique product / quality specifications requiring testing, inspection and certifications.
FDA
FDA (Food & Drug Administration) takes responsibility for determining whether and how manufactured materials may be used in contact with food products. Definitions for proper use are found in a series of regulations published annually under Government Regulations (CFR) 21. The FDA provide certain specifications regarding composition, additives, and properties. A material which meets these standards can then be stated as FDA COMPLIANT. End-users should note that it is their responsibility to use the product in a manner compatible with FDA guidelines.
USDA
USDA (U.S. Department of Agriculture) has jurisdiction over equipment used in federally inspected meat and poultry processing plants, and over packaging materials used for such products. Materials used in this equipment are approved on an individual basis. Determining suitability for use of components and the materials from which they are made is the responsibility of the equipment manufacturer. On request, MCAM-Quadrant will supply a Âôletter of guaranteeÂ" for a MCAM-Quadrant product listed as USDA compliant. This letter certifies that the material meets applicable FDA criteria. Supporting documentation as may be required by the Food Safety Inspection Service of USDA, is also available.
CANADA AG
Agriculture Canada (Food Production and Inspection Branch of the Canadian Government) is the Canadian government agency equivalent to the USDA. As with the USDA, plastic materials are approved per material for a group of related applications, such as Acetron® GP acetal (material) for meat and poultry processing (application).
3A-Dairy
3A-Dairy is a voluntary organization that provides standards of construction for milk, cheese, butter and ice cream processing equipment. The organization covers the requirements of plastic materials for multiple-use as product contact surfaces in equipment for production, processing, and handling of milk and milk products. The criteria for approval of plastic materials are specified in 3A standard 20-18, and include: cleanability, bacterial treatment, repeat use conditions, and FDA compliance. Materials are tested for compliance by the material supplier. Supporting documentation must be available as required by a food inspector.
NSF
NSF (National Sanitation Foundation) sets standards for all direct and indirect drinking water additives. Manufacturers who provide equipment displaying the NSF symbol have applied to the NSF for device approval to a specific standard. The approval is issued for the finished product (device) in a specific use (application). To obtain device approval, all components within the device must comply with the Standard. Establishing compliance of the equipmentÂ's components can be accomplished in one of two ways:
- The component has been tested to the Standard by the component supplier and is certified as such.
- The equipment manufacturer must supply documentation that the component meets the Standard, If any testing is required, it must be completed by the equipment manufacturer.
The NSF maintains numerous standards. Three standards which we frequently encounter and to which some of our products have been tested are:
- 51 Plastics in Food Equipment
- 61 Drinking Water System Components—Health Effects
- 14 Manufacture of Fittings and for Accessories other than Pipe Fittings
USP Class VI
USP (U.S. Pharmacopoeia) Class VI judges the suitability of plastic material intended for use as containers or accessories for parenteral preparations. Suitability under USP Class VI is typically a base requirement for medical device manufacturers.
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Richlite® Countertop Material
Richlite® comes in several grades including industrial composites, kitchen countertop material, and food prep surface material.
Richlite industrial composites combine many of the positive aspects of wood, metal, and plastic. Originally designed for use in the production of the Boeing 747, Richlite industrial material is hard, easy to machine, has a high strength to weight ratio, and is chemically and thermally stable. From cutting boards to prep tables, Richlite Food Surface has a lifetime beyond most other materials and is also easily maintained to provide a clean and sanitary work area
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Royalite® R-60
Royalite® R-60 Aircraft Grade Sheet is a rigid, fire-rated, proprietary thermoplastic sheet specifically formulated to meet the requirements of the FAR 25.853a flammability test. It provides outstanding color, gloss and grain control while virtually eliminating grain and gloss retention problems after forming that are often found in other fire-rated materials. ROYALITE® R60 combines very high impact strength and stiffness with excellent formability in deep draws. It has high resistance to normal food and environmental stains, and its cleanability with common cleaners is simply outstanding.
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Sanalite® HDPE Cutting Boards
Cutting Boards (commercial grade, full sheets or cut-to-size). - Sanalite® HDPE Cutting Boards - Cutting Boards from Sanalite HDPE or Polypropylene. Sanalite® is a premium cutting board material with a surface that is easy on cutting blades. Sanalite® cutting boards are used in a wide array of applications -- from home use to commercial food preparation and some of the largest packing plants in the United States. Excellent for restaurants, butcher blocks, prep tables, delis, bakeries, meat & fish processing.
Sanalite® is available in two formulations: High Density Polyethylene (HDPE) (standard) or Polypropylene (PP)
- Both are offered in a "Natural" color (white).
Standard Cutting Boards Sizes:
48" x 96" sheets (gauge sizes ranging from 1/4" to 1")
48" x 120" sheets (gauge sizes ranging from 1/4" to 1")
60" x 120" sheets
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Sanatec™ Lite
Sanatec™ Lite is 1/3 Less Weight than Solid Sanatec Cutting Boards due to it's Foamed Core. This material is a lower-cost alternative to other cutting board materials. It's closed / small cell structure is non absorbent, and is protected by a solid skinned surface.
Sanatec™ Lite is available in NATURAL Color Only with a MATTE Finish. This material is available in .375", .500" x .750" thicknesses
- Note: This product is NOT as durable as standard solid Sanatec Cutting Boards.
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![SciCron® AGM-700™ Anti-Glare/Anti-Microbial]( "SciCron® AGM-700™ Anti-Glare/Anti-Microbial")
SciCron® AGM-700™ Anti-Glare/Anti-Microbial
SciCron® AGM-700™ Anti-Glare/Anti-Microbial and AMC-800™ Anti-Microbial Clear are scientifically proven antimicrobial technology that will provide lasting and effective protection against harmful bacteria, mold, fungi and viruses by up to 99.99%. Articles within hygiene-critical environments are known to harbor pathogenic bacteria and other microbes for extended periods of time; the H1N1 genome, in particular, is reported to survive on surfaces for up to 24 hours. This combined with the increased prevalence of antibiotic resistance and reports that cleaning agents are having a reduced effect on microbial colonization.
AGM-700™ Anti-Glare/Anti-Microbial and AMC-800™ Anti-Microbial Clear are hydrophobic, easy to clean, cost effective, robust, hard coatings with very good antimicrobial properties. The coatings are designed for barrier surfaces and high touch applications, but it can be used where antimicrobial properties are needed on most plastic surfaces.
- Suitable for coating on Acrylic Sheets, Polycarbonate Sheets and Fabricated Plastic Parts
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![SciCron® AMC-800™ Anti-Microbial Clear]( "SciCron® AMC-800™ Anti-Microbial Clear")
SciCron® AMC-800™ Anti-Microbial Clear
SciCron® AMC-800™ Anti-Microbial Clear are scientifically proven antimicrobial technology that will provide lasting and effective protection against harmful bacteria, mold, fungi and viruses by up to 99.99%. Articles within hygiene-critical environments are known to harbor pathogenic bacteria and other microbes for extended periods of time; the H1N1 genome, in particular, is reported to survive on surfaces for up to 24 hours. This combined with the increased prevalence of antibiotic resistance and reports that cleaning agents are having a reduced effect on microbial colonization.
AMC-800™ Anti-Microbial Clear is hydrophobic, easy to clean, cost effective, robust, hard coatings with very good antimicrobial properties. The coatings are designed for barrier surfaces and high touch applications, but it can be used where antimicrobial properties are needed on most plastic surfaces.
- Suitable for coating on Acrylic Sheets, Polycarbonate Sheets and Fabricated Plastic Parts
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Seaboard™ Lite HDPE
Seaboard™ Lite HDPE
Seaboard Lite is a high density polyethylene (HDPE) sheet formulated to meet the specific requirements of marine and other outdoor environments. Seaboard Lite is UV stable and will withstand the elements without rotting, delaminating or peeling like wood. CPC Seaboard Lite is manufactured as a continuous extrusion. It is not press laminated. Thus, it is unconditionally guaranteed not to delaminate during the service life of the end-product.
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Sealant Tape D5170 - High-Tack & High-Temp
D5170
SEALANT TAPE
D5170 is a sealant tape that enables vacuum during cure cycles in oven and autoclave applications. It tenaciously adheres and seals nylon films to tool surfaces. It can be used with a broad range of cycle temperatures from 250°F/121°C to 450°F/232°C. D5170 compatibility and tenacious adhesion to a variety of tool surfaces and films, and unique curing characteristics makes it a premier choice for use in the composite industry. It cures tight and strips clean from tool surfaces warm or cold.
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![Semiconductor Processing Steps]( "Semiconductor Processing Steps")
Semiconductor Processing Steps
Semiconductor device fabrication is the process used to create chips, the integrated circuits that are present in everyday electrical and electronic devices. It is a multiple-step sequence of photographic and chemical processing steps during which electronic circuits are gradually created on a wafer made of pure semiconducting material. Silicon is the most commonly used semiconductor material today, along with various compound semiconductors. The entire manufacturing process from start to packaged chips ready for shipment takes six to eight weeks and is performed in highly specialized facilities referred to as fabs.
Wafers
A typical wafer is made out of extremely pure silicon that is grown into mono-crystalline cylindrical ingots (boules) up to 300 mm (slightly less than 12 inches) in diameter using the Czochralski process. These ingots are then sliced into wafers about 0.75 mm thick and polished to obtain a very regular and flat surface.
Once the wafers are prepared, many process steps are necessary to produce the desired semiconductor integrated circuit. In general, the steps can be grouped into two areas:
- Front end processing
- Back end processing
Processing
In semiconductor device fabrication, the various processing steps fall into four general categories:
- Deposition, Removal, Patterning, and Modification of electrical properties.
Deposition is any process that grows, coats, or otherwise transfers a material onto the wafer. Available technologies consist of physical vapor deposition (PVD), chemical vapor deposition (CVD), electrochemical deposition (ECD), molecular beam epitaxy (MBE) and more recently, atomic layer deposition (ALD) among others.
Removal processes are any that remove material from the wafer either in bulk or selective form and consist primarily of etch processes, both wet etching and dry etching such as reactive ion etch (RIE). Chemical-mechanical planarization (CMP) is also a removal process used between levels.
Patterning covers the series of processes that shape or alter the existing shape of the deposited materials and is generally referred to as lithography. For example, in conventional lithography, the wafer is coated with a chemical called a "photoresist". The photoresist is exposed by a "stepper", a machine that focuses, aligns, and moves the mask, exposing select portions of the wafer to short wavelength light. The unexposed regions are washed away by a developer solution. After etching or other processing, the remaining photoresist is removed by plasma ashing. Modification of electrical properties has historically consisted of doping transistor sources and drains originally by diffusion furnaces and later by ion implantation. These doping processes are followed by furnace anneal or in advanced devices, by rapid thermal anneal (RTA) which serve to activate the implanted dopants. Modification of electrical properties now also extends to reduction of dielectric constant in low-k insulating materials via exposure to ultraviolet light in UV processing (UVP). Many modern chips have eight or more levels produced in over 300 sequenced processing steps.
Front End Processing
"Front End Processing" refers to the formation of the transistors directly on the silicon. The raw wafer is engineered by the growth of an ultrapure, virtually defect-free silicon layer through epitaxy. In the most advanced logic devices, prior to the silicon epitaxy step, tricks are performed to improve the performance of the transistors to be built. One method involves introducing a "straining step" wherein a silicon variant such as "silicon-germanium" (SiGe) is deposited. Once the epitaxial silicon is deposited, the crystal lattice becomes stretched somewhat, resulting in improved electronic mobility. Another method, called "silicon on insulator" technology involves the insertion of an insulating layer between the raw silicon wafer and the thin layer of subsequent silicon epitaxy. This method results in the creation of transistors with reduced parasitic effects.
Silicon dioxide
Front end surface engineering is followed by: growth of the gate dielectric, traditionally silicon dioxide (SiO2), patterning of the gate, patterning of the source and drain regions, and subsequent implantation or diffusion of dopants to obtain the desired complementary electrical properties. In memory devices, storage cells, conventionally capacitors, are also fabricated at this time, either into the silicon surface or stacked above the transistor.
Metal layers
Once the various semiconductor devices have been created they must be interconnected to form the desired electrical circuits. This "Back End Of Line" (BEOL) the latter portion of the front end of wafer fabrication, not to be confused with "back end" of chip fabrication which refers to the package and test stages) involves creating metal interconnecting wires that are isolated by insulating dielectrics. The insulating material was traditionally a form of SiO2 or a silicate glass, but recently new low dielectric constant materials are being used. These dielectrics presently take the form of SiOC and have dielectric constants around 2.7 (compared to 3.9 for SiO2), although materials with constants as low as 2.2 are being offered to chipmakers.
Interconnect
Historically, the metal wires consisted of aluminium. In this approach to wiring often called "subtractive aluminium", blanket films of aluminium are deposited first, patterned, and then etched, leaving isolated wires. Dielectric material is then deposited over the exposed wires. The various metal layers are interconnected by etching holes, called "vias," in the insulating material and depositing tungsten in them with a CVD technique. This approach is still used in the fabrication of many memory chips such as dynamic random access memory (DRAM) as the number of interconnect levels is small, currently no more than four.
More recently, as the number of interconnect levels for logic has substantially increased due to the large number of transistors that are now interconnected in a modern microprocessor, the timing delay in the wiring has become significant prompting a change in wiring material from aluminium to copper and from the silicon dioxides to newer low-K material. This performance enhancement also comes at a reduced cost via damascene processing that eliminates processing steps. In damascene processing, in contrast to subtractive aluminium technology, the dielectric material is deposited first as a blanket film and is patterned and etched leaving holes or trenches. In "single damascene" processing, copper is then deposited in the holes or trenches surrounded by a thin barrier film resulting in filled vias or wire "lines" respectively. In "dual damascene" technology, both the trench and via are fabricated before the deposition of copper resulting in formation of both the via and line simultaneously, further reducing the number of processing steps. The thin barrier film, called Copper Barrier Seed (CBS), is necessary to prevent copper diffusion into the dielectric. The ideal barrier film is effective, but is barely there. As the presence of excessive barrier film competes with the available copper wire cross section, formation of the thinnest yet continuous barrier represents one of the greatest ongoing challenges in copper processing today.
As the number of interconnect levels increases, planarization of the previous layers is required to ensure a flat surface prior to subsequent lithography. Without it, the levels would become increasingly crooked and extend outside the depth of focus of available lithography, interfering with the ability to pattern. CMP (Chemical Mechanical Polishing) is the primary processing method to achieve such planarization although dry "etch back" is still sometimes employed if the number of interconnect levels is no more than three.
Wafer Test
The highly serialized nature of wafer processing has increased the demand for metrology in between the various processing steps. Wafer test metrology equipment is used to verify that the wafers are still good and haven't been damaged by previous processing steps. If the number of "dies" the integrated circuits that will eventually become "chips" on a wafer that measure as fails exceeds a predetermined threshold, the wafer is scrapped rather than investing in further processing.
Device Test
Once the Front End Process has been completed, the semiconductor devices are subjected to a variety of electrical tests to determine if they function properly. The proportion of devices on the wafer found to perform properly is referred to as the yield. The fab tests the chips on the wafer with an electronic tester that presses tiny probes against the chip. The machine marks each bad chip with a drop of dye. The fab charges for test time; the prices are on the order of cents per second. Chips are often designed with "testability features" to speed testing, and reduce test costs. Good designs try to test and statistically manage corners: extremes of silicon behavior caused by operating temperature combined with the extremes of fab processing steps. Most designs cope with more than 64 corners.
Packaging
Once tested, the wafer is scored and then broken into individual die. Only the good, undyed chips go on to be packaged. Plastic or ceramic packaging involves mounting the die, connecting the die pads to the pins on the package, and sealing the die. Tiny wires are used to connect pads to the pins. In the old days, wires were attached by hand, but now purpose-built machines perform the task. Traditionally, the wires to the chips were gold, leading to a "lead frame" (pronounced "leed frame") of copper, that had been plated with solder, a mixture of tin and lead. Lead is poisonous, so lead-free "lead frames" are now the best practice. Chip-scale package (CSP) is another packaging technology. Plastic packaged chips are usually considerably larger than the actual die, whereas CSP chips are nearly the size of the die. CSP can be constructed for each die before the wafer is diced.
The packaged chips are retested to ensure that they were not damaged during packaging and that the die-to-pin interconnect operation was performed correctly. A laser etches the chips' name and numbers on the package.
List of Steps:
This is a list of processing techniques that are employed numerous times in a modern electronic device and do not necessarily imply a specific order.
- Wafer Processing - Wet cleans - Photolithography - Ion implantation (in which dopants are embedded in the wafer creating regions of increased (or decreased) conductivity) - Dry etching - Wet etching - Plasma ashing - Thermal treatments - Rapid thermal anneal - Furnace anneals - Thermal oxidation - Chemical Vapor Deposition (CVD) - Physical Vapor Deposition (PVD) - Molecular Beam Epitaxy (MBE) - Electrochemical Deposition (ECD) - Chemical-mechanical planarization (CMP) - Wafer testing (where the electrical performance is verified) - Wafer backgrinding (to reduce the thickness of the wafer so the resulting chip can be put into a thin device like a smartcard or PCMCIA card.) - Die Preparation - Wafer mounting - Die cutting - IC Packaging - Die attachment - IC Bonding - Wire bonding - Flip chip - Tab bonding - IC Encapsulation - Baking - Plating - Lasermarking - Trim and form - IC Testing
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Semitron® MP 370
Semitron® MP 370 offers more choices in the design and manufacture of precision test sockets for the semiconductor manufacture industry. While maintaining the same excellent moisture absorption and high thermal resistance of PEEK, Semitron® MP 370 provides greater strength and dimensional stability. This custom formulation allows finer and cleaner detail due to it's excellent machinability. Semitron MP370 is available from Professional Plastics 22 locations in the USA, Singapore & Taiwan.
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Semitron® MPR1000
Semitron® MPR1000 is a new engineering material developed for Semiconductor applications and more specifically for use in vacuum chamber applications such as these found in Etch, CVD and Ion Implant. MPR stands for Maximum Plasma Resistance. This material is designed to replace Quartz & Ceramics in vacuum chamber applications.
The material was developed based on three key premises:
1. Longevity - Increased life in plasma chambers over traditional plastics such as polyimide (up to 25X over polyimide in ozone)
2. Clean - Low ionic metal content and low out-gassing
3. Value - Lower overall cost in use compared to traditional materials used in vacuum chamber applications such as quartz, ceramics, and engineering plastics
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Semitron® PP
Semitron® PP is polypropylene plate developed specifically for demanding Wet Process Semiconductor applications that requires a high level of dimensional stability.
MINIMAL CENTER LINE POROSITY
- MCAM-Quadrant has developed proprietary processing methods to minimize the high stress & center line porosity that is common with standard polypropylene
- The plates, ranging from 2" to 5" thickness are manufactured to the highest standards for use in the Semiconductor Wet Process Industry
SEMITRON® PP VS. STANDARD PP
Lower Internal Stress allows for accelerated fabrication cycles through faster speeds & feeds as well as reducing or eliminating the need to anneal.
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![Sign Tape - Hi Tack]( "Sign Tape - Hi Tack")
Sign Tape - Hi Tack
Sign Tape - Hi Tack
Graphic designers spend countless hours working to achieve just the right look for their clients. So when they've created special lettering, a high-impact logo or other graphics, nothing should get in the way of an ideal end result. That's why Main Tape has created a full line of products especially for positioning and protecting graphics.
The results are nothing short of perfection:
- Minimal errors in applying graphics
- Easy to handle
- No curling
- A smooth release
- No adhesive residue
PerfecTear™ paper application tapes
These tear cleanly, with no stringy, legging adhesive. They also provide superior performance in wet applications, with no gluey mess or time-consuming cleanup. Used for sign making, screen printing, digital printing and surface protection.
PreView&trade: application films
These tapes are ideal for easy registration of multiple colors. They laminate easily and lay flat for shipping.
Screen Seal&trade: tapes
These tapes prevent ink spillage during screen printing by creating an ink dam between the frame and mesh. Plus, Screen Seal wonÂ't lift or disintegrate when exposed to inks, solvents or cleaners.
Stripe Guard™ pin-striping tapes
Used in production of auto, RV and marine graphics, these crystal-clear tapes feature low-tack adhesives that wonÂ't leave residue, even after prolonged storage.
Pallet Guard™ masking tape -
Used by T-shirt printers, Pallet Guard protects pallets from spray adhesive and ink spillage. Best of all, it removes easily, leaves no residue and reduces overall clean-up time by up to 75 percent.
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