CMP Retaining Ring - Techtron® PPS Tubes

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OVERVIEW of CMP Retaining Ring - Techtron® PPS Tubes

Techtron® PPS CMP Retaining rings used in CMP machines utilize high-purity & long-wearing Techtron PPS.

PPS Retaining rings that hold 300 mm semiconductor wafers during chemical mechanical planarization (CMP) must withstand repeated exposure to harsh chemicals and abrasives. One way that semiconductor fabricators gain the stiffness, purity and toughness needed in CMP rings is to use rings machined from Techtron® PPS. These shapes are made from a proprietary grade of Fortron® polyphenylene sulfide (PPS).

Techtron® PPS shapes extend ring life significantly compared to acetal, polyester and generic PPS. Process experience shows that rings made from Techtron® PPS stock shapes withstand 2,000 to 5,000 CMP cycles compared to 1,000 to 2,000 cycles for rings made of these other generic PPS materials.

In CMP, a layer of silicon dioxide, aluminum, copper or other material on a semiconductor wafer is polished to an exacting flatness before circuitry is etched on it. The slurry used varies in abrasiveness and pH depending on the surface material. During CMP, a polishing pad rotates against a wafer mounted on a ceramic base and held in a retaining ring. In addition to withstanding the polishing compound, the ring must be dimensionally stable and cannot flex during polishing.

Techtron® PPS blanks are 12- to 24-in.-long tubes that are machined into retaining rings varying in height from 0.33 to 1.0 in. The 12-inch-diameter rings (I.D.) used with 300 mm wafers have wall thicknesses of 0.375 to 2.5 in. The Techtron® PPS used for ring blanks is a high-toughness grade that reduces chipping and breaking and has a tensile elongation of up to 25 percent.