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Glass Laminators - Security Glazing (3231-GL)
Glass Laminators - Security Glazing
Laminated glass is a type of safety glass that holds together when shattered. In the event of breaking, it is held in place by an interlayer, typically of polyvinyl butyral (PVB) or ethylene-vinyl acetate (EVA), between its two or more layers of glass. The interlayer keeps the layers of glass ...
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Pyralux® APR Polyimide Copper-Clad Laminate

Pyralux® APR Polyimide Copper-Clad Laminate
DuPont™ Pyralux® APR copper clad resistor laminate is ideal for advanced applications in military, aerospace, automotive and consumer electronics markets, where reliable embedded resistor technology, temperature tolerance, and robust processing is required.

This patented all polyimide composite is a double sided construction of polyimide film bonded to copper foil, and features Ticer Technologies' TCR® thin film copper resistor foil as one or both of the clad foils.

DuPont™ Pyralux® APR copper clad resistor laminate is available in a broad range of dielectric thicknesses and resistance levels, to provide designers, fabricators, and assemblers a wide variety of circuit constructions.

Sheet Sizes: 12" x 18" (305mm x 457mm), 12" x 24" (305mm x 610mm) , 18" x 24" (457mm x 610mm) , 24" x 36" (610mm x 914mm)

Pyralux® APR Polyimide Copper-Clad Laminate Features:
  • Excellent resistive layer tolerance and electrical performance
  • Excellent dielectric thickness tolerance
  • Embedded capacitance and resistance in a single laminate
  • Thin, rugged copper clad laminate with superior handling and processing
  • High copper polyimide resistor foil adhesion strength
  • Low coefficient of thermal expansion for flex and rigid multi-layer PCBs
  • Excellent thermal resistance, up to 180C (356F) M.O.T.
  • UL 94V-0, UL Registered, File E124294
  • Compatible with printed wiring board industry processes, IPC 4204/11 certified
  • (PYRALUX APR PI-CC) Pyralux® APR Polyimide Copper-Clad Laminate
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