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Aeseptic Sterile Beverage & Pharma Filling Systems (3823-BP)
Aeseptic Sterile Beverage & Pharma Filling Systems
Aseptic processing is commonly used for the packaging of milks, fruit juices, liquid whole eggs, gravies, & tomatoes. Fresh tomatoes are aseptically processed & packaged for year-round remanufacture into various food products. Aseptic processing is the process by which a sterile (aseptic) product ...
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Atlanta Branch Relocated June 2018

Pyralux® APR Copper-clad Resistor Laminate

DuPont™ Pyralux® APR copper clad resistor laminate is ideal for advanced applications in military, aerospace, automotive and consumer electronics markets, where reliable embedded resistor technology, temperature tolerance, and robust processing is required.

This patented all polyimide composite is a double sided construction of polyimide film bonded to copper foil, and features Ticer Technologies' TCR® thin film copper resistor foil as one or both of the clad foils.

DuPont™ Pyralux® APR copper clad resistor laminate is available in a broad range of dielectric thicknesses and resistance levels, to provide designers, fabricators, and assemblers a wide variety of circuit constructions.
  • Standard Sheet Sizes: 12" x 18", 12" x 24", 18" x 24" & 24" x 36"
    Features of Pyralux® APR Copper-clad Resistor Laminate
  • Excellent resistive layer tolerance and electrical performance
  • Excellent dielectric thickness tolerance
  • Embedded capacitance and resistance in a single laminate
  • Thin, rugged copper clad laminate with superior handling and processing
  • High copper polyimide resistor foil adhesion strength
  • Low coefficient of thermal expansion for flex and rigid multi-layer PCBs
  • Excellent thermal resistance, up to 180C (356F) M.O.T.
  • UL 94V-0, UL Registered, File E124294
  • Compatible with printed wiring board industry processes, IPC 4204/11 certified
  • (PYRALUX-APR-CC) Pyralux® APR Copper-clad Resistor Laminate
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