Links:
Meldin vs Vespel Comparative Data
Meldin 7000 Series Overview
Meldin Molded Plates & DF Parts Data
Meldin Isostatic Rods Data
Meldin Machining Guidelines
Other Grades of Meldin
Meldin 7021
Meldin 7022
Meldin 7211
Meldin 7003
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Meldin® 7001 Polyimide - Unfilled
Meldin® 7001 Unfilled Polyimide Rods & Plates offer superior mechanical properties & high chemical resistance. Meldin® 7001 is ideal for electrical and thermal insulating applications. More ductile than ceramics, and lighter weight than metals, Meldin® 7001 is a popular choice for structural parts in aerospace and other applications where metal replacement is desirable.
In Semiconductor Wafer Processing applications, the plasma etch rate of Meldin® 7001 is 10% to 20% lower than Vespel® SP-1 providing superior performance over time. (contact us for complete details)For IC Test Sockets & Probe Test Heads, Meldin® 7001 is also an excellent replacement for Vespel® SP-1
Meldin 7000 products feature operational temperatures of 600ºF for continuous operation and 900ºF for intermittent exposure, and tight tolerances of ±0.001 in. on both ODs and IDs.
The 7001 grade is suitable for high-temperature structural, high-purity semiconductor, and welding component applications.
Meldin Plates are Compression Molded
Meldin Rods are Isostatically Molded (ISO)
Meldin DF Parts are Direct Formed.
Applications:
Wafer Clamping Rings, IC Test Sockets & Nests, Plasma Torch Gas Distributor, Bearings, Seals, Insulators, Thrust Washers
Meldin's 12" x 12" plates have 44% more material than Vespel's 10" x 10" plate.
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Features of Meldin® 7001 Polyimide:
Operates from Cryogenic to 315°C (600°F) & Intermittently to 482°C (900°F)
Self-lubricating properties
Lower Plasma Etch Rate than Vespel® SP-1
Meldin ® is a registered trade name of Saint Gobain Performance Products.
Vespel ® is a registered trade name of Ei DuPont DeNemours.
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