|
|
| Home • Release Film D7000
|
D7000 Release Film Data Sheet
|
|
Release Film D7000
Release Film D7000
D7000
High Performance Release & Parting Film
A new generation of films combining the chemical inertness and universal non-stick properties of PTFE polymers with maximum conformability and heat resistance.
D7000 exhibits superior release qualities over the entire temperature range. It has been successfully used in intermittent service temperature above 600°F. The high elongation allows for superior conformability for irregular shapes.
Consider D7000 for the most advanced thermosetting and thermoplastic resin systems in the curing temperature range of epoxy, phenolic, BMI and comparable resins (350°F-400°F) as well as higher temperatures (600°F) where D7000, in fact, proves to be the only conformable yet thermally stable film available.
|
 |
Compare the data shown for D7000 versus other materials typically used in composite fabrication in order to understand the superior performance particularly for complex shapes and high temperature resins.
D7000 - Elongation: 450% - Max Temp: 600 F
Teflon FEP - Elongation: 300% - Max Temp: 500 F
Teflon PFA - Elongation: 430% - Max Temp: 550 F
Tedlar PVF - Elongation: 190% - Max Temp: 350 F
Halar ECTFE - Elongation: 200% - Max Temp: 350 F
STANDARD PERFORATION PATTERNS:
P -— .045" diameter on 1/4" staggered centers. Used as porous
materials for high resin flow
P3 -— .015" diameter on 1/4" staggered centers
P4 -— .045" diameter on 2" centers
P5 -— .045" diameter on 3-1/2" centers
P7 -— .015" diameter on 3" centers; S designed for P1 and Phenolic
P8 -— .015" diameter on 8" centers; S for net resin prepregs
|
|
|
|
