Polyimide ( PI ) is a polymer of imide monomers. Thermosetting polyimides are commercially available as stock shapes, thin sheets, laminates and machined parts. Thermosetting polyimides are known for thermal stability, good chemical resistance, and excellent mechanical properties. Thermoset polyimides exhibit very low creep and high tensile strength. These properties are maintained during continuous use to temperatures of 450°F (232°C) and for short excursions, as high as 900°F (482°C). Molded polyimide parts and laminates have very good heat resistance. Normal operating temperatures for such parts and laminates range from cryogenic to those exceeding 500°F (260°C). Polyimides are also inherently resistant to flame combustion and do not usually need to be mixed with flame retardants. Most carry a UL rating of VTM-0. Polyimide laminates have a flexural strength half life at 480°F (249°C) of 400 hours. Typical polyimide parts are not affected by commonly used solvents and oils — including hydrocarbons, esters, ethers, alcohols and freons. They also resist weak acids but are not recommended for use in environments that contain alkalis or inorganic acids. Polyimide shapes are produced via Isostatic Molding, Compression Molding or Direct-Forming. Polyimide materials are lightweight, flexible, resistant to heat and chemicals. Therefore, they are used in the electronics industry for flexible cables, as an insulating film on magnet wire and for medical tubing. The semiconductor industry uses polyimide for components such as Clamp Rings, Screws, Seals and Wafer Handling Components.
.jpg "(PLAVIS-ESD) Plavis ESd® - ESd Polyimide")
.jpg "(PYRALUX APR PI-CC) Pyralux® APR Polyimide Copper-Clad Laminate")
