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Extem®
Extem® is a high-heat, amorphous, melt-processable thermoplastic polyimide that performs well from below zero to a continuous-use temperature of 230°C (446°F). Extem® combines outstanding heat resistance with very good processability. Potential applications range from semiconductor wafer handling and oil and gas processing to aerospace, automotive, and electronics manufacturing.
Extem® 's amorphous nature gives it good dimensional stability, creep resistance, and strength at elevated temperatures (although these properties fall off sharply as it nears its 311°C glass transition temperature, where it turns soft and rubbery). The amorphous structure resists chemicals, especially chlorinated solvents. It is also inherently flame retardant. Extem is rated for 50°C higher continuous-use temperatures than is Ultem® (PEI) melt-processible resin. Ultem ® PEI does not stand up as well as Extem® does to chlorinated solvents and other chemicals. Extem retains its strength and stiffness above 200°C better than polyetheretherketone or polyethersulfone. In addition, when compared to Torlon® polyamide-imide, Torlon® has better heat resistance, but usually needs annealing for prolonged periods following melt processing.
Extem is available in two standard grades. The first, Extem UH, has the higher glass transition temperature (311°C) and better chemical resistance. Extem XH has a lower glass transition (267°C), but better flow and creep resistance. Both materials are available in glass and mineral-reinforced grades.
These two grades are the start of a family of as many as 75 new Extem grades. By blending Extem with PEEK, PES, Ultem, and other engineering resins, Extem offers resins with price and performance optimized for specific applications.
Extem® is a registered tradename of General Electric.
Torlon® is a registered tradename of Solvay Advanced Polymers'.
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Extem® Features:
High-heat, amorphous, melt-processable thermoplastic polyimide.
Performs well from below zero to a continuous-use temperature of 230°C.
Outstanding heat resistance with very good processability.
Potential applications range from semiconductor wafer handling and oil and gas processing to aerospace, automotive, and electronics manufacturing.
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